WEICON C 铝修补剂
液态 | 铝填充 | 耐220℃高温铝填充环氧树脂产品，用于修复和铸造模型
规格型号：
10000032(10100005)0.5KG IMPA:812903 ;
10000033(10100020)2.0KG IMPA:812904 ；
主要应用
• 结构性修补：2小时初固实现85 Shore D硬度，抗压强度＞110MPa
• 模具灌封：流动性达DIN 53019标准，可填充0.2mm级微孔隙
• 工装制造：支持制作耐高温夹具、定位治具等定制化工具
WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress.
